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| CL-2025-02 ? / packaging information ? packaging information / ?` reference pattern layout dimensions unit : inch (mm) ??? / reference metal mask design ?` / reference pattern layout *CL-2025-02 ?g?? 0.05mm ??X?
CL-2025-02 ` /reel ?`?? /taping specifications ?`?? / ta p in g s p ecifications 3,000pcs/reel CL-2025-02 power dissipation power dissipation data for the qfn-24 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 1000 100.00 85 400 1. measurement condition (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board dimensions: 40 x 40 mm (1600mm 2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter evaluation board (unit:mm) 2. power dissipation vs. ambient temperature board mount ( t j max=125 ) |
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